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PolyZen Devices
PolyZen Devices
Polymer Protected Zener Diode
PolyZen devices are polymer enhanced precision Zener diode micro-assemblies that help protect sensitive electronics from damage caused by inductive voltage spikes, voltage transients, use of incorrect power supplies and reverse bias. The PolyZen micro-assembly incorporates a stable Zener diode for precise voltage clamping and a resistively non-linear, polymeric positive temperature coefficient (PPTC) layer that responds to either diode heating or overcurrent events by transitioning from a low to high resistance state.
4
PolyZen devices help provide resettable protection against damage caused by multi-watt fault events and require only 0.7W power dissipation. In the event of sustained high power conditions, the PPTC element of the device "trips" to limit current and generate voltage drop. This functionality helps protect both the Zener and the follow-on electronics, effectively increasing the diode's power handling capacity.
Benefits
* Helps shield downstream electronics from overvoltage and reverse bias * Trip events shut out overvoltage and reverse bias sources * Analog nature of trip events minimize upstream inductive spikes * Helps reduce design costs with single component placement and minimal heat sinking requirements
Features
* RoHS compliant * Overvoltage transient suppression * Hold currents up to 2.3A * Time delayed, overvoltage trip * Time delayed, reverse bias trip * Power handling on the order of 30 watts * Integrated device construction
Applications
* Portable media players * Global positioning systems * Hard disk drives 5V & 12V bus * Solid State Drives (SSD) 5V bus * Cellphone charger port and USB power * Automotive peripheral input power * DC power port protection * Industrial handheld POS
27
Figure PZ1 Typical Application Block Diagram for PolyZen Devices
Power Supply
(External or internal)
Protected Electronics GND
VIN 1 +
2 PolyZen Device 3
VOUT
Regulated Output RLOAD Protected downstream electronics
Table PZ1 Electrical Characteristics for PolyZen Devices
4
(Performance ratings @ 25C unless otherwise specified)
VZ(V) IZt (A) IHOLD @ 20C (A) RTyp () R1MAX () VINT MAX VINT MAX (V) Test Current (A) IFLT MAX IFLT MAX (A) Test Voltage (V)
Part Number
Min.
Typ.
Max.
ZEN056V130A24LS ZEN065V130A24LS
NEW
5.45 6.35 9.60 13.20 16.10 5.45 6.35 13.20 5.45 13.20 5.45 5.45 5.80
5.6 6.5 9.8 13.4 16.4 5.6 6.5 13.4 5.6 13.4 5.6 5.6 5.9
5.75 6.65 10.00 13.60 16.60 5.75 6.65 13.60 5.75 13.60 5.75 5.75 6.00
0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1
1.3 1.3 1.3 1.3 1.3 2.3 2.3 2.3 0.75 0.75 1.15 1.30 1.30
0.12 0.12 0.12 0.12 0.12 0.04 0.04 0.04 0.28 0.28 0.15 0.12 0.12
0.16 0.16 0.16 0.16 0.16 0.06 0.06 0.06 0.45 0.45 0.18 0.18 0.16
24V 24V 24V 24V 24V 16V 16V 16V 48V 48V 24V 24V 24V
3A 3A 3A 3A 3A 5A 5A 5A 3A 3A 3A 3A 3A
+10/-40 +6/-40 +3.5/-40 +2/-40 +1.25/-40 +5/-40 +3.5/-40 +2/-40 +10/-40 +2/-40 +10/-40 +6/-40 +6/-40
+24/-16V +24/-16V +24/-16V +24/-16V +24/-16V +16/-12V +16/-12V +20/-12V +48/-16V +48/-16V +24/-16V +24/-16V +24/-16V
ZEN098V130A24LS ZEN132V130A24LS ZEN164V130A24LS ZEN056V230A16LS ZEN065V230A16LS ZEN132V230A16LS ZEN056V075A48LS ZEN132V075A48LM
NEW NEW Coming* Soon
ZEN056V115A24LS ZEN056V130A24GS ZEN059V130A24LS
* Data is preliminary Maximum Reverse Leakage Current = 650A@5.0V meets USB suspend mode specification
Table PZ2 Definitions of Terms for PolyZen Devices
VZ IZt IHOLD RTyp R1MAX IFLT IFLT MAX VINT MAX Zener clamping voltage measured at current IZt and 20C. Test current at which VZ is measured. Maximum steady state current IPTC that will not generate a trip event at the specified temperature. Ratings assume IFLT = 0A. Typical resistance between VIN and VOUT pins when the device is at room temperature. The maximum resistance between VIN and VOUT pins, at room temperature, one hour after first trip or after reflow soldering. Current flowing through the Zener diode. Maximum RMS fault current the Zener diode component of the device can withstand and remain resettable; testing is conducted at rated voltage with no load connected to VOUT. The voltage (VIN - VOUT "post trip") at which typical qualification devices (98% devices, 95% confidence) survived at least 100 trip cycles and 24 hours trip endurance when "tripped" at the specified voltage and current (IPTC). A condition where the PPTC transitions to a high resistance state, thereby limiting IPTC, and significantly increasing the voltage drop between VIN and VOUT.
VIN
IFLT IPTC
Polymer PTC VIN Zener Diode GND
IOUT
VOUT
VOUT
Trip Event
GND
28
RoHS Compliant, ELV Compliant
PolyZen Devices
Figure PZ2-PZ9 Typical Performance Curves for PolyZen Devices
Figure PZ2
VOUT Peak vs IFLT RMS (IOUT = 0)
22.0 20.0 18.0 16.0 10
Figure PZ3
Time-to-Trip vs IFLT RMS (IOUT = 0)
A = ZEN056V1yyA24LS/GS B = ZEN065V130A24LS C = ZEN098V130A24LS
A = ZEN056V1yyA24LS/GS
E D C
B = ZEN065V130A24LS C = ZEN098V130A24LS D = ZEN132V130A24LS E = ZEN164V130A24LS
Time-to-Trip (Sec)
VOUT Peak (V)
14.0 12.0 10.0 8.0 6.0 4.0 2.0 0 0 1 2 3 4 5 6
1
D = ZEN132V130A24LS E = ZEN164V130A24LS
E
0.1
B
A
D
C
B
A
0.01 7 8 9 10 0 1 2 3 4 5 6 7 8 9 10
IFLT RMS (A)
IFLT RMS (A)
Figure PZ4
VOUT Peak vs IFLT RMS (IOUT = 0)
22.0 20.0 18.0 16.0
Figure PZ5
Time-to-Trip vs IFLT RMS (IOUT = 0)
100
4
A = ZEN056V230A16LS B = ZEN065V230A16LS C = ZEN132V230A16LS
A = ZEN056V230A16LS B = ZEN065V230A16LS C = ZEN132V230A16LS
14.0 12.0 10.0 8.0 6.0 4.0 2.0 0 0 1 2 3 4 5 6 7 8 9 10
Time-to-Trip (Sec)
C
10
VOUT Peak (V)
1
B
A
0.1
C
B
A
0.01 0 1 2 3 4 5 6 7 8 9 10
IFLT RMS (A)
IFLT RMS (A)
Figure PZ6
VOUT Peak vs IFLT RMS (IOUT = 0)
0.0
Figure PZ7
Time-to-Trip vs IFLT RMS (IOUT = 0)
100
A = ZENxxxV1yyA24LS/GS
-0.2
A = ZENxxxV1yyA24LS/GS B = ZENxxxV230A16LS
10
B = ZENxxxV230A16LS C = ZENxxxV075A48LS/M
C = ZENxxxV075A48LS/M
VOUT Peak (V)
-0.4
Time-to-Trip (Sec)
1
-0.6
0.1
-0.8
-1.0
0.01
B A C
-50 -40 -30 -20 -10 0
A B
-40 -30
-1.2 -50
C
-20 -10 0
0.001
IFLT RMS (A)
IFLT RMS (A)
Figure PZ8
Temperature Effect on IHOLD (IFLT = 0)
3.5
Figure PZ9
Time-to-Trip vs IPTC RMS (IFLT = 0)
10
A = ZENxxxV130A24LS/GS
3.0 2.5
A = ZENxxxV1yyA24LS/GS B = ZENxxxV230A16LS C = ZENxxxV075A48LS/M
B
B = ZENxxxV230A16LS C = ZENxxxV075A48LS/M D = ZENxxxV115A24LS
2.0 1.5 1.0 0.5
A D C
Time-to-Trip (Sec)
1
IHOLD (A)
0.1
0.01
B C A
40 45
0.0 -40 -20 0 20 40 60 80 100
0.001 0 5 10 15 20 25 30 35
Ambient Temperature (C)
IPTC RMS (A)
RoHS Compliant
29
Table PZ3 General Characteristics for PolyZen Devices
Operating temperature range Storage temperature ESD withstand Diode capacitance Construction -40 to +85C -40 to +85C 15kV 4200pF RoHS compliant
Human body model Typical @ 1MHz, 1V RMS
Figure PZ10-PZ22 Basic Operation Examples for PolyZen Devices
Figure PZ10
Hot-Plug Response ZEN056V130A24LS vs a 22V/120W Universal Power Supply
35 350
C
30
Capacitive Current Spike Current Pulled to GND via diode Supply Voltage dropped by current
A = VIN Supply Voltage returns to normal A
200
B = VOUT C = CURRENT (IFLT) D = POWER
300
Voltage (V) and Current (A)
4
25
250
20
D
15
PPTC switches to high resistance A
Output Voltage remains clamped
150
10
100
B
5
B VOUT Peak D C
0.03 0.04 0.05 0.06 0.07 0.08
50
0 0 0.01 0.02
0
Time (Sec)
Figure PZ11
Typical Fault Response: ZEN056V115A24LS 20V, 3.5A Current Limited Source (IOUT=0)
20 18
Figure PZ12
Typical Fault Response: ZEN056V130A24LS 24V, 3.5A Current Limited Source (IOUT=0)
20 18
A = VIN (V) B = VOUT (V) C = IFLT (A)
A Voltage (V) or Current (A)
A = VIN (V) B = VOUT (V) C = IFLT (A)
A
Voltage (V) or Current (A)
16 14 12 10 8 6 4 2 0 -0.02
16 14 12 10 8 6 4 2
B
B
C
0.02 0.06 0.10 0.14 0.18
0 -0.02
C
0.02 0.06 0.10 0.14 0.18
Time (s)
Time (s)
Figure PZ13
Typical Fault Response: ZEN065V130A24LS 24V, 5.0A Current Limited Source (IOUT=0)
26 24
Figure PZ14
Typical Fault Response: ZEN098V130A24LS 24V, 3.5A Current Limited Source (IOUT=0)
24 22
A = VIN (V) B = VOUT (V) C = IFLT (A)
Voltage (V) or Current (A)
Voltage (V) or Current (A)
22 20 18 16 14 12 10 8 6 4 2 0 0
A
A = VIN (V) B = VOUT (V) C = IFLT (A)
A
20 18 16 14 12 10 8 6 4
B
B
C
0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.10
2 0 0.00 0.05 0.10
C
0.15
Time (s)
Time (s)
30
RoHS Compliant, ELV Compliant
Power (Watts)
PolyZen Devices
Figure PZ16-PZ22 Basic Operation Examples for PolyZen Devices
Figure PZ15
Typical Fault Response: ZEN132V130A24LS 24V, 2.0A Current Limited Source (IOUT=0)
30 30
Cont'd
Figure PZ16
Typical Fault Response: ZEN164V130A24LS 24V, 1.0A Current Limited Source (IOUT=0)
A = VIN (V)
A = VIN (V)
Voltage (V) or Current (A)
25
A
Voltage (V) or Current (A)
B = VOUT (V) C = IFLT (A)
25
B = VOUT (V) C = IFLT (A)
A B
20
20
15
B
15
10
10
5
5
C
0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0 0.00 0.10 0.20 0.30 0.40
C
0.50
Time (s)
Time (s)
Figure PZ17
Typical Fault Response: ZEN056V230A16LS 16V, 5.0A Current Limited Source (IOUT=0)
20
Figure PZ18
Typical Fault Response: ZEN065V230A16LS 16V, 3.5A Current Limited Source (IOUT=0)
20
4
A = VIN (V)
A = VIN (V)
Voltage (V) or Current (A)
B = VOUT (V)
15
A
Voltage (V) or Current (A)
B = VOUT (V)
15
A
C = IFLT (A)
C = IFLT (A)
10
10
B
5
B
5
C
0 0.00 0.10 0.20 0.30 0 0.00 0.10 0.20
C
0.30
Time (s)
Time (s)
Figure PZ19
Typical Fault Response: ZEN132V230A16LS 20V, 2.0A Current Limited Source (IOUT=0)
22 20
Figure PZ20
Typical Fault Response: ZEN056V075A48LS 48V, 10.0A Current Limited Source (IOUT=0)
50
A = VIN (V) B = VOUT (V) C = IFLT (A)
A Voltage (V) or Current (A)
40
A = VIN (V) B = VOUT (V) C = IFLT (A)
A
Voltage (V) or Current (A)
18 16 14 12 10 8 6 4 2 0 0
B
30
20
10
B C
0.05 0.10 0.15 0.20 0.25 0.30 0 0.00
C
0.01 0.02 0.03 0.04
Time (s)
Time (s)
Figure PZ21
Typical Fault Response: ZEN132V075A48LM 48V, 2.0A Current Limited Source (IOUT=0)
50 45
Figure PZ22
Typical Fault Response: ZEN056V130A24GS 24V, 1.0A Current Limited Source (IOUT=0)
24 22
A = VIN (V) B = VOUT (V) C = IFLT (A)
A Voltage (V) or Current (A)
A = VIN (V) B = VOUT (V) C = IFLT (A)
A
Voltage (V) or Current (A)
40 35 30 25 20 15 10 5 0
20 18 16 14 12 10 8 6 4 2
B
B
C
0 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20
0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
C
0.8 0.9 1.0
Time (s)
Time (s)
RoHS Compliant
31
Table PZ4 Packaging and Marking Information for PolyZen Devices
Part Number ZENxxxVyyyAzzLS/M ZENxxxVyyyAzzGS Bag Quantity Tape & Reel Quantity 3,000 4,000 Standard Package 15,000 20,000
Table PZ5 Dimensions for PolyZen Devices
ZENxxxVyyyAzzLS/M Devices
A Min. mm inch 3.85 Max. 4.15 Min. 3.85 B Max. 4.15 Min. 1.4 (0.055) C Max. 2.0 (0.081)
A B C
(0.152) (0.163)
(0.152) (0.163)
4
ZENxxxVyyyAzzGS Devices
L Min. mm inch 3.85 Max. 4.15 Min. 3.85 W Max. 4.15 Min. 1.16 (0.046) H Max. 1.25 (0.049)
W
(0.152) (0.163)
(0.152) (0.163)
L
H
Table PZ6 Pad Layout and Configuration Information for PolyZen Devices
Pin Number 1 2 3 Pin Name VIN GND VOUT Pin Function VIN = Protected input to Zener diode GND = Ground VOUT = Zener regulated voltage output
Pin Configuration (Top View)
Pad Dimensions
2 GND VIN 1 3 VOUT 2.21mm (0.087") 0.33mm (0.013")
0.94mm (0.037")
0.94mm (0.037")
0.56mm (0.022")
2.88mm (0.1135")
0.56mm (0.022")
32
RoHS Compliant, ELV Compliant
PolyZen Devices
Solder Reflow and Rework Recommendation for PolyZen Devices
Classification Reflow Profiles
Profile Feature Average ramp up rate (TsMAX to Tp) Preheat * Temperature min. (TsMIN) * Temperature max. (TsMAX) * Time (tsMIN to tsMAX) Time maintained above: * Temperature (TL) * Time (tL) Peak/Classification temperature (Tp) Time within 5C of actual peak temperature Time (tp) Ramp down rate Time 25C to peak temperature Pb-Free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds 260C 20-40 seconds 6C/second max. 8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
4
tp Critical Zone TL to Tp
Figure PZ23
Tp Ramp up TL
TsMAX
tL
Temperature
TsMIN ts Preheat
Ramp down
25 Reflow Profile
t 25C to Peak Time
Tape and Reel Specifications for PolyZen Devices (in Millimeters)
Figure PZ24 EIA Referenced Taped Component Dimensions for PolyZen Devices (in Millimeters)
Description A0 B0 K0 ZENxxxVyyyAzzLS/M Devices 4.35 4.35 2.30
8.00 4.00Note 1 0.35 0.05 2.00 0.05Note 3 o1.5 + 0.1 / -0.0 o1.50 Min 0.25 R A 1.75 0.10
ZENxxxVyyyAzzGS Devices 4.35 4.35 1.80
R 0.3 Max 5.50 0.05Note 3 B0 12.0 0.3
K0
A0
0.25
A
Notes: 1. 10 sprocket hole pitch cumulative tolerance 0.2 2. Camber in compliance with EIA 481 3. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole
RoHS Compliant
33
Figure PZ25 Reel Dimensions for PolyZen Devices (in Millimeters)
Matte Fi nish These Area
Description AMax NMin W1 W2
Dimension (mm) 330 102 8.4 11.1
o20.0 Min
Lock Feature (6 places)
NMin AMax +0.25 330.0 -4.00 102.0 Ref
+0.5 o13.0 -0.2 2.0 +/- 0.5 Detail A See "Detail A"
W1 (measured at hub) W2 (measured at hub)
4
Part Numbering System for PolyZen Devices
ZEN 056V 130A 24 LS/M & GS
Special Labeling LS or M = Module Height of 2.0mm GS = Module Height of 1.25mm VINT Max Rating (24 = 24V) PPTC Hold Current Group (130 = 1.3A) Zener Voltage Group (056 = 5.6V) PolyZen Series
Part Marking System for PolyZen Devices
ZENxxxVyyyAzzLS/M Devices
Zener Diode Voltage Rating 056 = 5.6V 059 = 5.9V 065 = 6.5V 098 = 9.8V 132 = 13.4V 164 = 16.4V Batch Number
ZENxxxVyyyAzzGS Devices
Zener Diode Voltage Rating 056 = 5.6V t056 1234567
Batch Number
t056 12345
Warning :
All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and test each product selected for their application. Tyco Electronics Corporation makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use. Tyco Electronics' only obligations are those in the Tyco Electronics' Standard Terms and Conditions of Sale for this product, and in no case will Tyco Electronics be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In addition, Tyco Electronics reserves the right to make changes to materials or processing that do not affect compliance with any applicable specification without notification to Buyer. 34
RoHS Compliant, ELV Compliant

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